Implantable packaging
Biocompatible packaging for electronics and biosensors: materials, methods and feedthrough design, with examples of robust packages built with metal, ceramic or polymer encapsulation.
Our packaging workOpportunities
We are interested in hearing from engineers and scientists with expertise in the areas below. Depending on your experience and career path, positions may be at the postdoctoral researcher, staff scientist, research associate or engineer level.
Wireless power transfer
Inductive power transfer and resonant coupling, with a history of building miniaturized wireless power receivers, either custom or on standards such as AirFuel or Qi.
Our wireless implantNeural interfaces
Electrical, optical or electrochemical interfaces to the central and peripheral nervous system for recording and stimulation, with demonstrated robust chronic implants.
Our nerve stimulation workIntegrated circuit design
Mixed-signal analog front-ends for neural recording and stimulation, across schematic capture, simulation, layout, verification and tapeout. Wireless telemetry experience preferred.
How to apply
Email tdatta@northwell.edu with your CV and a short note on what you would like to work on.
Students and interns
The lab hosts interns and visiting scholars and sponsors engineering design projects for Hofstra University students. See recent student projects.